|Date||Tuesday, April 13, 2021|
|Time||9:30 AM - 10:00 AM CDT|
To maximize efficiency and optimize costs, operators need accurate dimensions and physical characteristics of every SKU in their mix, which is difficult to build and maintain in today’s high-throughput, high-mix environments with ever-changing source packaging.
This seminar will compare the key sensing technologies for capturing this SKU-level data in real-time, including 3D depth cameras, and newly available 3D millimeter-wave sensors that image items through opaque packaging.
We will explain the physics of these sensors, explain their benefits and limitations, and show how they can be used to build accurate SKU-level data in real-time, at conveyor speed, on a diverse SKU mix. We will also show how 3D sensors can be used to automatically audit your storage and packing operations to provide real-time feedback on how well your facility is performing. This includes automated tracking of cube utilization, item count, and detection of missing or damaged items.
• How accurate SKU-level data can dramatically reduce shipping and storage costs for conventional and ASRS facilities.
• How to build real-time SKU-level data with the right choice of 3D sensing technologies, including 3D depth cameras and newly-available 3D millimeter-wave sensors.
• How to automatically audit your storage and packing operations.