|Date||Wednesday, April 14, 2021|
|Time||10:30 AM - 11:15 AM|
To optimize shipping and storage costs, operators need accurate dimensions and physical characteristics of every SKU in their mix, which is difficult to build and maintain in today’s high-throughput, high-mix environments with ever-changing source packaging. This seminar will compare the key sensing technologies for capturing this SKU-level data in real time, including 3D depth cameras, and newly-available 3D millimeter wave sensors that image items through opaque packaging. We will explain the physics of these sensors, explain their benefits and limitations, and show how they can be used to build accurate SKU-level data in real-time, at conveyor speed, on a diverse SKU mix. We will also show how 3D sensors can be
used to automatically audit your outbound packing operations to provide real-time feedback on how well your facility is performing.
How accurate SKU-level data can dramatically reduce shipping and storage costs for conventional and
How to build real-time SKU-level data with the right choice of 3D sensing technologies, including 3D depth
cameras and newly-available 3D millimeter-wave sensors, and how to automatically audit your outbound